Papers - Yan, Jiwang
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Restoration of the retention force of a small-diameter thermoplastic resin-bonded wheel by laser treatment
H. Matsuura, Y. Kunieda, N. Yoshihara, M. Tanabe, J. Yan, and T. Kuriyagawa
Journal of the Japan Society for Precision Engineering 176 ( 3 ) 327-332 2010.03
Research paper (scientific journal), Joint Work, Accepted
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Ultrasonic-assisted micro-grinding using electroplated diamond wheels (2nd Report: Effect of ultrasonic vibration on workpiece removal in grinding with wheel end)
K. Shimada, T. Tateishi, N. Yoshihara, J. Yan, and T. Kuriyagawa
Journal of the Japan Society for Abrasive Technology 54 ( 1 ) 37-40 2010.01
Research paper (scientific journal), Joint Work, Accepted
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Performance of the thermoplastic resin-bonded diamond wheel
H. Matsuura, S. Kodama, Y. Kunieda, N. Yoshihara, M. Tanabe, J. Yan, and T. Kuriyagawa
Journal of the Japan Society for Abrasive Technology 53 ( 12 ) 756-761 2009.12
Research paper (scientific journal), Joint Work, Accepted
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Development of the thermoplastic-resin bonded diamond wheel and the control of protrusion height by irradiation with laser light using a flashlamp-pumped pulse laser
H. Matsuura, S. Kodama, Y. Kunieda, N. Yoshihara, M. Tanabe, J. Yan, and T. Kuriyagawa
Journal of the Japan Society for Abrasive Technology 53 ( 11 ) 679-683 2009.11
Research paper (scientific journal), Joint Work, Accepted
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Fundamental investigation on subsurface damage in single crystalline silicon caused by diamond machining
J. Yan, T. Asami, H. Harada, and T. Kuriyagawa
Precision Engineering 33 ( 4 ) 378-386 2009.11
Research paper (scientific journal), Joint Work, Accepted
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Recovery of microstructure and surface topography of grinding-damaged silicon wafers by nanosecond-pulsed laser irradiation
J. Yan, S. Sakai, H. Isogai, and K. Izunome
Semiconductor Science and Technology 24 ( 10 ) 105018 (1-6) 2009.10
Research paper (scientific journal), Joint Work, Accepted
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Investigation on the viscoelasticity of optical glass in ultraprecision lens molding process
T. Zhou, J. Yan, J. Masuda, and T. Kuriyagawa
Journal of Materials Processing Technology 209 ( 9 ) 4484-4489 2009.10
Research paper (scientific journal), Joint Work, Accepted
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Precision machining of microstructures on electroless-plated NiP surface for molding glass components
J. Yan, T. Oowada, T. Zhou, and T. Kuriyagawa
Journal of Materials Processing Technology 209 ( 10 ) 4802-4808 2009.10
Research paper (scientific journal), Joint Work, Accepted
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Effect of Electrorheological Fluid Assistance for Micro Ultrasonic Machining
T. Tateishi, K. Shimada, N. Yoshihara, J. Yan, T. Kuriyagawa
Advanced Materials Research 76-78 148-152 2009.09
Research paper (scientific journal), Joint Work, Accepted
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Processing Grinding-damaged Silicon Wafers by Nano-second Laser Irradiation
J. Yan, S. Muto, T. Kuriyagawa
Advanced Materials Research 76-78 451-456 2009.09
Research paper (scientific journal), Joint Work, Accepted
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Effects of tool edge radius on ductile machining of silicon: an investigation by FEM
J. Yan, H. Zhao, and T. Kuriyagawa
Semiconductor Science and Technology 24 ( 7 ) 075018 (1-11) 2009.07
Research paper (scientific journal), Joint Work, Accepted
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Modeling high-temperature glass molding process by coupling heat transfer and viscous deformation analysis
J. Yan, T. Zhou, J. Masuda, and T. Kuriyagawa
Precision Engineering 33 ( 2 ) 150-159 2009.06
Research paper (scientific journal), Joint Work, Accepted
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Mechanism for material removal in diamond turning of reaction-bonded silicon carbide
J. Yan, Z. Zhang, and T. Kuriyagawa
International Journal of Machine Tools & Manufacture 49 ( 5 ) 366-374 2009.05
Research paper (scientific journal), Joint Work, Accepted
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Microstructural and Topographical Changes of Ni-P Plated Molds in Glass Lens Pressing
J. Masuda, J. Yan, T. Tashiro, Y. Fukase, T. Zhou and T. Kuriyagawa
International Journal of Surface Science and Engineering 3 ( 1-2 ) 86-102 2009.03
Research paper (scientific journal), Joint Work, Accepted
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Study on electrorheological fluid-assisted micro ultrasonic machining
T. Tateishi, N. Yoshihara, J. Yan, and T. Kuriyagawa
International Journal of Abrasive Technology 2 ( 1 ) 70-82 2009.03
Research paper (scientific journal), Joint Work, Accepted
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Finite element modeling of high-pressure deformation and phase transformation of silicon beneath a sharp indenter
T. Kiriyama, H. Harada, and J. Yan
Semiconductor Science and Technology 24 ( 2 ) 025014 (1-12) 2009.02
Research paper (scientific journal), Joint Work, Accepted
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Fabricating Nano Ribbons and Nano Fibers of Semiconductor Materials by Diamond Turning
J. Yan, X. Gai and T. Kuriyagawa
Journal of Nanoscience and Nanotechnology 9 ( 2 ) 1423-1427 2009.02
Research paper (scientific journal), Joint Work, Accepted
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Shape transferability and microscopic deformation of molding dies in aspherical glass lens molding press
J. Yan, T. Zhou, N. Yoshihara, and T. Kuriyagawa
Journal of Manufacturing Technology Research 1 ( 1-2 ) 85-102 2009.02
Research paper (scientific journal), Joint Work, Accepted
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Fabrication of micro end mills by wire EDM and some micro cutting tests
J. Yan, K. Uchida, N. Yoshihara, and T. Kuriyagawa
Journal of Micromechanics and Microengineering 19 ( 2 ) 025004 (1-9) 2009.02
Research paper (scientific journal), Joint Work, Accepted
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Ultrasonic-assisted micro-grinding using electroplated diamond wheels
K. Shimada, T. Tateishi, N. Yoshihara, J. Yan, and T. Kuriyagawa
Journal of the Japan Society for Abrasive Technology 53 ( 1 ) 45-48 2009.01
Research paper (scientific journal), Joint Work, Accepted