Papers - Kuroda, Tadahiro
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A 280Mb/s In-Vehicle LAN System Using Electromagnetic Clip Connector and High-EMC Transceiver
KURODA TADAHIRO
IEEE Transactions on Circuits and Systems-I: Regular Papers (TCAS-I) 68 ( 2 ) 265 - 275 2016.02
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Efficient 3-D Bus Architecture for Inductive-Coupling ThruChip Interface,
KURODA TADAHIRO
IEEE Transaction on Very Large Scale Integration (VLSI) Systems 24 ( 2 ) 2016.02
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A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel,
KURODA TADAHIRO
EICE Trans. on Fundamentals E98-A ( 12 ) 2584 - 2591 2015.12
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半導体ディジタルロゼッタストーン
KURODA TADAHIRO
電子情報通信学会誌 98 ( 12 ) 1057 - 1062 2015.12
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Analysis and Design of an 8.5-Gb/s/link Multi-Drop Bus Using Energy-Equipartitioned Transmission Line Couplers,
KURODA TADAHIRO
EEE Transactions on Circuits and Systems-I: Regular Papers (TCAS-I) vol. 62 ( no. 8, ) 2122 - 2131 2015.08
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Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network
KURODA TADAHIRO
EICE TRANSACTIONS on Electronics Vol.E98-C ( No.4, ) 322 - 332 2015.05
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A 6Gb/s 6pJ/b 5mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Couplar and EMC-Qualified Pulse Transceiver
KURODA TADAHIRO
IEEE International Solid-State Circuits Conference(ISSCC'15) 176 - 177 2015.02
Research paper (international conference proceedings)
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A 6.5Gb/s Shared Bus using Electromagnetic Connectors for Downsizing and Lightening Satellite Processor System by 60%
KURODA TADAHIRO
IEEE International Solid-State Circuits Conference (ISSCC'15) 434 - 435 2015.02
Research paper (international conference proceedings), Joint Work
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Circuit and Package Design for 44GB/s Inductive-Coupling DRAM/SoC Interface
KURODA TADAHIRO
20th Asia and South Pacific Design Automation Conference(ASP-DAC'15) 44 - 45 2015.01
Research paper (international conference proceedings)
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Design and Analysis for ThruChip Design for Manufacturing(DFM)
KURODA TADAHIRO
20th Asia and South Pacific Design Automation Conference(ASP-DAC'15) 46 - 47 2015.01
Research paper (international conference proceedings)
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Circuit and Device Interactions for 3D Integration Using Inductive Coupling
KURODA TADAHIRO
2014 IEEE International Electron Devices Meeting (IEDM'14) 18.6 2014.12
Research paper (international conference proceedings)
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近接場接合を用いたLSIとモジュールの三次元集積
KURODA TADAHIRO
電子情報通信学会論文誌 378 - 385 2014.11
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車載LAN向け非接触コネクタおよび高ノイズ耐性送受信回路
KURODA TADAHIRO
電子情報通信学会技術研究報告 23 - 27 2014.10
Research paper (scientific journal)
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3D Integration by Inductive Coupling
KURODA TADAHIRO
IEEE Custom Integrated Circuits Conf. (CICC) 2014.09
Research paper (international conference proceedings)
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Low-Cost 3D Chip Stacking with ThruChip Wireless Connections
KURODA TADAHIRO
Hot Chips - A Symposium on High Performance Chips 2014.08
Research paper (international conference proceedings)
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A 352Gb/s Inductive-Coupling DRAM/SoC Interface Using Overlapping Coils with Phase Division Multiplexing and Ultra-Thin Fan-Out Wafer Level Package
KURODA TADAHIRO
IEEE Symposium on VLSI Circuits, Dig. Tech Papers 29 - 30 2014.06
Research paper (international conference proceedings)
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3-D NoC with Inductive-Coupling Links for Building-Block SiPs
KURODA TADAHIRO
IEEE Transactions on Computers 63 ( 3 ) 748 - 763 2014.03
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A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler
KURODA TADAHIRO
IEEE Journal of Solid-State Circuits(JSSC) 49 ( 1 ) 223 - 231 2014.01
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実装インタコネクトの課題
KURODA TADAHIRO
日本信頼性学会誌 35 ( 8 ) 469 - 469 2013.12
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A Scalable 3D Heterogeneous Mulicore with an Inductive Thru Chip Interface
KURODA TADAHIRO
IEEE Micro 33 ( 6 ) 6 - 15 2013.12