Presentations -
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Contactless Interfaces in 3D-Integration
ISHIKURO HIROKI
IEEE International Solid-State Circuits Conference 2010 (San Francisco, CA, USA) ,
2010.02,Oral presentation (invited, special), IEEE
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A 2.5Gb/s/ch 4PAM inductive-coupling transceiver for non-contact memory card
S.Kawai, H. Ishikuro, T. Kuroda
IEEE International Solid-State Circuits Conference(ISSCC) (San Francisco, California, USA) ,
2010.02,Oral presentation (general), IEEE
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A Wafer test method of inductive-coupling link
K. Kasuga, M. Saito, T. Takeya, N. Miura, H. Ishikuro, T. Kuroda
IEEE Asian Solid-State Circuits Conference (A-SSCC) (Taipei, Taiwan) ,
2009.11,Oral presentation (general), IEEE
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アナログ離散時間信号処理のための高線形かつ広帯域サンプリング回路
佐藤守、阿部寛之、黒田忠広、石黒仁揮
電子情報通信学会集積回路研究会 (東京) ,
2009.10,Oral presentation (general), 電子情報通信学
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47% power reduction and 91% area reduction in inductive-coupling programmable bus for NAND flash memory stacking
M. Saito, Y.Sugimori, Y.Kohama, Y.Yoshida, N. Miura, H.Ishikuro, T. Kuroda,
IEEE Custom Integrated Circuits Conference(CICC) (San Jose, USA) ,
2009.09,Oral presentation (general), IEEE
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A 90nm CMOS highly linear clock bootstrapped RF sampler operating at wide frequency range of 0.5GHz to 5GHz
M. Sato, H. Abe, M Hamada, H. Majima, T. Kuroda, H. Ishikuro
IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (Boston, USA) ,
2009.06,Oral presentation (general), IEEE
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A 4.7Gb/s inductive coupling interposer with dual mode modem
S. Kawai, H. Ishikuro, T. Kuroda
IEEE Symposium on VLSI Circuit (Kyoto, Japan) ,
2009.06,Oral presentation (general), IEEE
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A 2Gb/s 15pJ/b/chip Inductive-Coupling programmable bus for NAND Flash memory stacking
Y.Sugimori, Y. Kohama, M.Saito, Y. Yoshida, N. Miura, H. Ishikuro, T. Sakurai, T. Kuroda
IEEE International Solid-State Circuits Conference(ISSCC) (San Francisco, California, USA) ,
2009.02,Oral presentation (general), IEEE
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A wireless real-time on-chip bus trace system
S. Kawai, T.Ikari, Y.Takikawa, H.Ishikuro, T. Kuroda,
Asia and South Pacific Design Automation Conference (ASP-DAC) (Yokohama, Japan) ,
2009.01,Oral presentation (general), IEEE
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A wireless real-time on-chip bus trace system using quasi-synchronous parallel inductive coupling transceivers
S.Kawai, T. Ikari, Y.Takikawa, H. Ishikuro, T. Kuroda
IEEE Asian Solid-State Circuits Conference (A-SSCC) (Hakata, Japan) ,
2008.11,Oral presentation (general), IEEE
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A 65 fJ/b inductive-coupling inter-chip transceiver using charge recycling technique for power-aware 3D system integration
K.Niitsu, S. Kawai, N. Miura, H. Ishikuro, T. Kuroda
IEEE Asian Solid-State Circuits Conference (A-SSCC) (Hakata, Japan) ,
2008.11,Oral presentation (general), IEEE
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Pulse-Based Inductive-Coupling Interface for High-Speed Proximity Communication
ISHIKURO HIROKI
IEEE 2008 Asia-Pacific Solid-State Circuits Workshop (Seoul, Korea) ,
2008.08,Oral presentation (invited, special), IEEE
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An 11Gb/s Inductive-Coupling Link with Burst Transmission
N.Miura, Y. Kohama, Y. Sugimori, H. Ishikuro, T. Sakurai, T. Kuroda,
IEEE International Solid-State Circuits Conference (ISSCC) (San Francisco, California, USA) ,
2008.02,Oral presentation (general), IEEE
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Interference from power/signal lines and to SRAM circuits in 65nm CMOS inductive-coupling link
K.Niitsu, Y. Sugimori, Y. Kohama, K. Osada, N. Irie, H. Ishikuro, T. Kuroda,
IEEE Asian Solid-State Circuits Conference (ASSCC) (Jeju, Korea) ,
2007.11,Oral presentation (general), IEEE
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Wideband Inductive-coupling Interface for High-performance Portable System
ISHIKURO HIROKI, Noriyuki Miura, Tadahiro Kuroda
IEEE Custom Integrated Circuits Conference 2007 (San Jose, California USA) ,
2007.09,Oral presentation (invited, special), IEEE
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A 0.14pJ/b Inductive-Coupling Inter-Chip Data Transceiver with Digitally-Controlled Precise Pulse Shaping
Noriyuki Miura, Hiroki Ishikuro, Takayasu Sakurai, Tadahiro Kuroda
IEEE International Solid- State Circuits Conference (ISSCC) (SanFransisco CA, USA) ,
2007.02,Oral presentation (general), IEEE
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An Attachable Wireless Chip-Access Interface for Arbitrary Data Rate Using Pulse-Based Inductive-Coupling through LSI Package
Hiroki Ishikuro
IEEE International Solid-State Circuits Conference (ISSCC) (San Francisco) ,
2007.02,Oral presentation (general), IEEE
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60% Power Reduction in Inductive-Coupling Inter-Chip Link by Current-Sensing Technique
K.Niitsu, N.Miura, M.Inoue, Y.Nakagawa, M.Tago, M.Fukaishi, H.Ishikuro and T.Kuroda
International Conference on Solid State Devices and Materials (SSDM 2006) (Yokohama, Japan) ,
2006.09,Oral presentation (general), THE JAPAN SOCIETY OF APPLIED PHYSICS
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Compact outside-rail circuit structure by single-cascode two-transistor topology
Atit Tamtrakarn, Hiroki Ishikuro, Koichi Ishida and Takayasu Sakurai
IEEE Custom Integrated Circuits Conference (CICC) (San Jose, California) ,
2006.09,Oral presentation (general), IEEE
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Constant Magnetic Field Scaling in Inductive-Coupling Data Link
D.Mizoguchi, N.Miura, H.Ishikuro and T.Kuroda
International Conference on Solid State Devices and Materials (SSDM 2006) (Yokohama, Japan) ,
2006.09,Oral presentation (general), THE JAPAN SOCIETY OF APPLIED PHYSICS