Papers - Omiya, Masaki

Strength evaluation of notch structure for semiconductor encapsulant resin

Kawamura N, Kawakami T, Kishimoto K, Omiya M, Shibuya T

Transactions of ASME, Journal of Electronic Packaging 124   323-327 2002

Research paper (scientific journal), Joint Work, Accepted

Mechanical Characterization of Sn-Ag-based lead-free solders

Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto and Toshikazu Shibuya

Microelectronics Reliability 42   951-966 2002

Research paper (scientific journal), Joint Work, Accepted

界面結合力モデルを用いた界面破壊基準の検討Vol.51 (2002), pp.1367-1372.

OMIYA Masaki

材料 (日本材料学会)  51   1367-1372 2002

Research paper (scientific journal), Joint Work, Accepted

Sn-Ag-Cu系鉛フリーはんだの機械的特性

OMIYA Masaki

エレクトロニクス実装学会誌 (エレクトロニクス実装学会)  5 ( 6 ) 551-558 2002

Research paper (scientific journal), Joint Work, Accepted

Effect of intermetallic compound layer development on interfacial strength of solder joints

Omiya, Masaki, Kishimoto, Kikuo, Shibuya, Toshikazu and Amagai, Masazumi,

Advances in Electronic Packaging 2   1157-1164 2001

Research paper (scientific journal), Joint Work, Accepted

結合力モデルを用いた異材界面き裂の有限要素解析

OMIYA Masaki

日本機械学会論文集(A編), Vol.66 (2000), pp.532-539. (日本機械学会)  66   532-539 2000

Research paper (scientific journal), Joint Work, Accepted

The Influence of Plastic Deformation on Interface Fracture Behavior

M. Omiya, K. Kishimoto and T. Shibuya

Key Engineering Materials 183-187   541-546 2000

Research paper (scientific journal), Joint Work, Accepted