Papers - Omiya, Masaki
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Deformation and failure behaviors of PC/ABS (50/50) blends under impact
Machmud M. Nizar, Omiya Masaki, Inoue Hirotsugu, Kishimoto Kikuo
Key Engineering Materials 340-341 319-324 2007
Research paper (scientific journal), Joint Work, Accepted
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配線用銅薄膜界面に対する付着強度評価法の検討
下村紘志, 神谷庄司, 大宮正毅, 鈴木貴志
日本機械学会2007年度年次大会 (日本機械学会) 2007
Research paper (conference, symposium, etc.), Joint Work
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Mechanical Parameters Characterizing Interface Crack and Interface Strength Evaluation Testing
Kikuo Kishimoto, OMIYA Masaki, Kentaro Kozuki
日本接着学会誌 43 ( 11 ) 443-451 2007
Research paper (scientific journal), Single Work, Accepted
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Compressive Deformatino in Aluminum Foam Investigated Using a 2D Object Oriented Finite Element Modeling Approach
M.F. Adziman, S. Deshpande, M. OMIYA, H. Inoue, K. Kishimoto
Key Engineering Materials 353-358 651-654 2007
Research paper (conference, symposium, etc.), Joint Work, Accepted
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Crack Formation of Ceramic Thin Film on Polymer Substrate
M. Omiya, K. Kishimoto
Key Engineering Materials 353-358 307-310 2007
Research paper (scientific journal), Joint Work, Accepted
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Effect of Ni Plating Thickness on Fatigue Failure of Lead-Free Solder Joints
Masaki Oomiya, Takeshi Miyazaki, Hirotsugu Inoue, Kikuo Kishimoto, Masazumi Amagai
8th International Conference on Electronics Materials and Packaging (EMAP2006) (IEEE CPMT) 2006.12
Research paper (conference, symposium, etc.), Joint Work
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分子鎖ネットワークを用いた高分子材料の剥離と押し込み解析
OMIYA Masaki
計算数理工学論文集 (計算数理工学会) 6 ( 3 ) 147-152 2006.12
Research paper (scientific journal), Joint Work, Accepted
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高分子基材上におけるセラミックス薄膜のき裂形成に及ぼす紫外線の影響
Masaki OMIYA, Kikuo KISHIMOTO
材料 (日本材料学会) 55 ( 12 ) 1081-1087 2006.12
Research paper (scientific journal), Joint Work, Accepted
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A Phenomenological Constitutive Model Constructed for PC/ABS Blends
M.Nizar Machmud, Masaki Omiya, Hirotsugu Inoue, Kikuo Kishimoto
Key Engineering Materials 306-308 989-994 2006.03
Research paper (scientific journal), Joint Work, Accepted
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Fracture of Brittle Thin Film on Polymer Substrate
M.Omiya and K.Kishimoto
Theoretical and Applied Mechanics Japan 54 93-99 2005
Research paper (scientific journal), Joint Work, Accepted
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Modeling of a Gc-sensing element for the interfacial toughness of metal thin films on substrates
Insu Jeon, Masaki Omiya, Kikuo Kishimoto, Tadashi Asahina, Seyoung Im
Sensors and Actuators A: Physical 122 291-300 2005
Research paper (scientific journal), Joint Work, Accepted
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UV-Irradiation Effects on Interfacial Strength between Thin Ceramic Film and Polymer substrate
Masaki Omiya, Hirotsugu Inoue, Kikuo Kishimoto, Masaaki Yanaka and Noritaka Ihashi
Key Engineering Materials 297-300 2284-2289 2005
Research paper (scientific journal), Single Work, Accepted
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A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate
I. Jeon, Masaki Omiya, Hirotsugu Inoue, Kikuo Kishimoto, T. Asahina
Key Engineering Materials 297-300 521-526 2005
Research paper (scientific journal), Joint Work, Accepted
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Impact Behavior Analysis of PC/ABS (50/50) Blends
M. Nizar Machmud, Masaki Omiya, Hirotsugu Inoue, Kikuo Kishimoto
Key Engineering Materials 297-300 1297-1302 2005
Research paper (scientific journal), Joint Work, Accepted
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Evaluation of Interfacial Strength by Multi-stages Peel Test
M.Omiya, H.Inoue and K.Kishimoto
Key Engineering Materials 261-263 483-488 2004
Research paper (scientific journal), Joint Work, Accepted
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Effects of Meso-scale Structure and Interactions on Macro-scale Mechanical Properties in Polymeric Materials
A.Shinozaki, M.Omiya, H.Inoue and K.Kishimoto
Key Engineering Materials 261-263 747-752 2004
Research paper (scientific journal), Joint Work, Accepted
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高分子フィルム上に形成したぜい性薄膜の界面付着強度評価
OMIYA Masaki
材料 (日本材料学会) 53 856-861 2004
Research paper (scientific journal), Joint Work, Accepted
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A Key Matrix N^ for the Stress Singularity of the Anisotropic Elastic Composite Wedges
Chanbin Hwu, Masaki Omiya, Kikuo Kishimoto,
JSME International Journal Series A (日本機械学会) 46 40-50 2003
Research paper (scientific journal), Joint Work, Accepted
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Interface Debonding Model and its application to the Mixed Mode Interface Fracture Toughness
M. Omiya, K. Kishimoto and W. Yang
International Journal of Damage Mechanics 11 263-286 2002
Research paper (scientific journal), Joint Work, Accepted
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Fracture Mechanics of Bonding Interface – A Cohesive Zone Model -
K. Kishimoto, M. Omiya, W. Yang
Sensors and actuators, A Physical 99 198-206 2002
Research paper (scientific journal), Joint Work, Accepted