Presentations -

A 6Gb/s Receiver With Discrete-Time Based Channnel Filtering For Wireline FDM Communications

KURODA TADAHIRO

[International presentation]  IEEE Custom Integrated Circuits Conference (CICC) (San Francisco, U.S.A.) , 

2010.09

, 

Oral presentation (general)

Through Chip Interface (TCI) for 3D System Integration

KURODA TADAHIRO

[International presentation]  2010 MPSoC (Beijin) , 

2010.07

, 

Oral presentation (invited, special)

A 0.7V 20fJ/bit Inductive-Coupling Data Link with Dual-Coil Transmission Scheme

KURODA TADAHIRO

[International presentation]  IEEE Symposium on VLSI Circuits (Hawai, U.S.A.) , 

2010.06

, 

Oral presentation (general)

Simultaneous 6Gb/s Data and 10mW Power Transmission using Nested Clover Coils for Non-Contact Memory Card

KURODA TADAHIRO

[International presentation]  IEEE Symposium on VLSI Circuits (Hawai, U.S.A.) , 

2010.06

, 

Oral presentation (general)

Through Chip Interface (TCI) for 3D System Integration

KURODA TADAHIRO

[International presentation]  2010VLSI-TSA/VLSI-DAT Symposium (Taiwan) , 

2010.04

, 

Oral presentation (invited, special)

“MMSE Timing Recovery using Multi-Channel Early-Late Gates for Analog Multi-Tone Systems,”

KURODA TADAHIRO T. Takeya, and T. Kuroda,

[International presentation]  4th International Symposium on Communications, Control and Signal Processing (ISCCSP'10) (Kypros) , 

2010.03

, 

Oral presentation (general)

“A 2Gb/s 1.8pJ/b/chip Inductive-Coupling Through-Chip Bus for 128-Die Nand-Flash Memory Stacking,”

KURODA TADAHIRO M. Saito, N. Miura, and T. Kuroda,

[International presentation]  IEEE International Solid-State Circuits Conference (ISSCC'10) (San francisco) , 

2010.02

, 

Oral presentation (general)

"Inductively Coupled Through-Chip Interface,"

KURODA TADAHIRO

[International presentation]  IEEE International Solid-State Circuits Conference (ISSCC'10) (San francisco) , 

2010.02

, 

Oral presentation (general)

“A 2.5Gb/s/ch Inductive-Coupling Transceiver for Non-Contact Memory Card,”

KURODA TADAHIRO S. Kawai, H. Ishikuro, and T. Kuroda,

[International presentation]  IEEE International Solid-State Circuits Conference (ISSCC'10) (San francisco) , 

2010.02

, 

Oral presentation (general)

"A Versatile Recognition Processor for Sensor Network Applications,"

KURODA TADAHIRO R. Takashima, Y. Hanai, Y. Hori and T. Kuroda,

[International presentation]  IEEE Asia and South Pacific Design Automation Conference(ASP-DAC'10) (Taiwan) , 

2010.01

, 

Oral presentation (general)

"Inductive Coupling Transceivers for Inter-chip Data Communication (invited),"

KURODA TADAHIRO

[International presentation]  IEEE International Symposium on Radio-Frequency Intefration Technology (RFIT2009) (Singapore) , 

2009.12

, 

Oral presentation (general)

"An Extended XY Coil for Noise Reduction in Inductive-coupling Link,"

KURODA TADAHIRO M. Saito, K. Kasuga, T. Takeya, N. Miura, and T. Kuroda,

[International presentation]  IEEE Asian Solid-State Circuits Conference(A-SSCC'09) (Taiwan) , 

2009.11

, 

Oral presentation (general)

"Face detection through compact classifier using adaptive look-up-table,"

KURODA TADAHIRO, Y. Hanai and T. Kuroda

[International presentation]  IEEE International Conference on Image Processing (ICIP) (Egypt) , 

2009.11

, 

Oral presentation (general)

"A Wafer Test Method of Inductive-Coupling Link,"

KURODA TADAHIRO K. Kasuga, M. Saito, T. Takeya, N. Miura, H. Ishikuro and T. Kuroda,

[International presentation]  IEEE Asian solid state circuit conference (A-SSCC'09) (Taiwan) , 

2009.11

, 

Oral presentation (general)

"47% Power Reduction and 91% Area Reduction in Inductive-Coupling Programmable Bus forNAND Flash Memory Stacking,"

KURODA TADAHIRO M. Saito, Y. Sugimori, Y. Kohama, Y. Yoshida, N. Miura, H. Ishikuro, and T. Kuroda,

[International presentation]  IEEE Custom Integrated Circuits Conference (CICC) (San Francisco) , 

2009.09

, 

Oral presentation (general)

"Split Capacitor DAC Mismatch Calibration in Successive Approximation ADC,"

KURODA TADAHIRO Y. Chen, X. Zhu, H. Tamura, M. Kibune, Y Tomita, T. Hamada, M. Yoshioka, K. Ishikawa, T. Takayama, J. Ogawa, S. Tsukamoto and T. Kuroda,

[International presentation]  IEEE Custom Integrated Circuits Conference (CICC) (San Francisco) , 

2009.09

, 

Oral presentation (general)

"Is TSV 3D LSI’s and Packaging Finally Ready or Is It Just Another Fantasy?"

KURODA TADAHIRO

[International presentation]  IEEE Symposium on VLSI Circuits (Kyoto) , 

2009.06

, 

Oral presentation (general)

A 4.7 Gb/s Inductive Coupling Interposer with Dual Mode Modem

KURODA TADAHIRO

[International presentation]  IEEE Symposium on VLSI Circuits (Kyoto) , 

2009.06

, 

Oral presentation (general)

"Digital Rosetta Stone: A Sealed Permanent Memory with Inductive-Coupling Power and Data Link,"

KURODA TADAHIRO Y. Yuan, N. Miura, S. Imai, H. Ochi and T. Kuroda,

[International presentation]  IEEE Symposium on VLSI Circuits (Kyoto) , 

2009.06

, 

Oral presentation (general)

"A Scalable 3D Processor by Homogeneous Chip Stacking with Inductive-Coupling Link,"

KURODA TADAHIRO Y. Kohama, Y. Sugimori, S. Saito, Y. Hasegawa, T. Sano, K. Kasuga, Y. Yoshida, K. Niitsu, N. Miura, H. Amano, and T. Kuroda,

[International presentation]  IEEE Symposium on VLSI Circuits (Kyoto) , 

2009.06

, 

Oral presentation (general)