Presentations -

A 6Gb/s Receiver With Discrete-Time Based Channnel Filtering For Wireline FDM Communications

KURODA TADAHIRO

[International presentation]  IEEE Custom Integrated Circuits Conference (CICC) (San Francisco, U.S.A.) , 

2010.09

, 

Oral presentation (general)

Through Chip Interface (TCI) for 3D System Integration

KURODA TADAHIRO

[International presentation]  2010 MPSoC (Beijin) , 

2010.07

, 

Oral presentation (invited, special)

A 0.7V 20fJ/bit Inductive-Coupling Data Link with Dual-Coil Transmission Scheme

KURODA TADAHIRO

[International presentation]  IEEE Symposium on VLSI Circuits (Hawai, U.S.A.) , 

2010.06

, 

Oral presentation (general)

Simultaneous 6Gb/s Data and 10mW Power Transmission using Nested Clover Coils for Non-Contact Memory Card

KURODA TADAHIRO

[International presentation]  IEEE Symposium on VLSI Circuits (Hawai, U.S.A.) , 

2010.06

, 

Oral presentation (general)

Through Chip Interface (TCI) for 3D System Integration

KURODA TADAHIRO

[International presentation]  2010VLSI-TSA/VLSI-DAT Symposium (Taiwan) , 

2010.04

, 

Oral presentation (invited, special)

“MMSE Timing Recovery using Multi-Channel Early-Late Gates for Analog Multi-Tone Systems,”

KURODA TADAHIRO T. Takeya, and T. Kuroda,

[International presentation]  4th International Symposium on Communications, Control and Signal Processing (ISCCSP'10) (Kypros) , 

2010.03

, 

Oral presentation (general)

“A 2Gb/s 1.8pJ/b/chip Inductive-Coupling Through-Chip Bus for 128-Die Nand-Flash Memory Stacking,”

KURODA TADAHIRO M. Saito, N. Miura, and T. Kuroda,

[International presentation]  IEEE International Solid-State Circuits Conference (ISSCC'10) (San francisco) , 

2010.02

, 

Oral presentation (general)

"Inductively Coupled Through-Chip Interface,"

KURODA TADAHIRO

[International presentation]  IEEE International Solid-State Circuits Conference (ISSCC'10) (San francisco) , 

2010.02

, 

Oral presentation (general)

“A 2.5Gb/s/ch Inductive-Coupling Transceiver for Non-Contact Memory Card,”

KURODA TADAHIRO S. Kawai, H. Ishikuro, and T. Kuroda,

[International presentation]  IEEE International Solid-State Circuits Conference (ISSCC'10) (San francisco) , 

2010.02

, 

Oral presentation (general)

"A Versatile Recognition Processor for Sensor Network Applications,"

KURODA TADAHIRO R. Takashima, Y. Hanai, Y. Hori and T. Kuroda,

[International presentation]  IEEE Asia and South Pacific Design Automation Conference(ASP-DAC'10) (Taiwan) , 

2010.01

, 

Oral presentation (general)

"Inductive Coupling Transceivers for Inter-chip Data Communication (invited),"

KURODA TADAHIRO

[International presentation]  IEEE International Symposium on Radio-Frequency Intefration Technology (RFIT2009) (Singapore) , 

2009.12

, 

Oral presentation (general)

"Face detection through compact classifier using adaptive look-up-table,"

KURODA TADAHIRO, Y. Hanai and T. Kuroda

[International presentation]  IEEE International Conference on Image Processing (ICIP) (Egypt) , 

2009.11

, 

Oral presentation (general)

"A Wafer Test Method of Inductive-Coupling Link,"

KURODA TADAHIRO K. Kasuga, M. Saito, T. Takeya, N. Miura, H. Ishikuro and T. Kuroda,

[International presentation]  IEEE Asian solid state circuit conference (A-SSCC'09) (Taiwan) , 

2009.11

, 

Oral presentation (general)

"An Extended XY Coil for Noise Reduction in Inductive-coupling Link,"

KURODA TADAHIRO M. Saito, K. Kasuga, T. Takeya, N. Miura, and T. Kuroda,

[International presentation]  IEEE Asian Solid-State Circuits Conference(A-SSCC'09) (Taiwan) , 

2009.11

, 

Oral presentation (general)

"47% Power Reduction and 91% Area Reduction in Inductive-Coupling Programmable Bus forNAND Flash Memory Stacking,"

KURODA TADAHIRO M. Saito, Y. Sugimori, Y. Kohama, Y. Yoshida, N. Miura, H. Ishikuro, and T. Kuroda,

[International presentation]  IEEE Custom Integrated Circuits Conference (CICC) (San Francisco) , 

2009.09

, 

Oral presentation (general)

"Split Capacitor DAC Mismatch Calibration in Successive Approximation ADC,"

KURODA TADAHIRO Y. Chen, X. Zhu, H. Tamura, M. Kibune, Y Tomita, T. Hamada, M. Yoshioka, K. Ishikawa, T. Takayama, J. Ogawa, S. Tsukamoto and T. Kuroda,

[International presentation]  IEEE Custom Integrated Circuits Conference (CICC) (San Francisco) , 

2009.09

, 

Oral presentation (general)

A 4.7 Gb/s Inductive Coupling Interposer with Dual Mode Modem

KURODA TADAHIRO

[International presentation]  IEEE Symposium on VLSI Circuits (Kyoto) , 

2009.06

, 

Oral presentation (general)

"Digital Rosetta Stone: A Sealed Permanent Memory with Inductive-Coupling Power and Data Link,"

KURODA TADAHIRO Y. Yuan, N. Miura, S. Imai, H. Ochi and T. Kuroda,

[International presentation]  IEEE Symposium on VLSI Circuits (Kyoto) , 

2009.06

, 

Oral presentation (general)

"A Scalable 3D Processor by Homogeneous Chip Stacking with Inductive-Coupling Link,"

KURODA TADAHIRO Y. Kohama, Y. Sugimori, S. Saito, Y. Hasegawa, T. Sano, K. Kasuga, Y. Yoshida, K. Niitsu, N. Miura, H. Amano, and T. Kuroda,

[International presentation]  IEEE Symposium on VLSI Circuits (Kyoto) , 

2009.06

, 

Oral presentation (general)

"3D System Integration of Processor and Multi-Stacked SRAMs by Using Inductive-Coupling Links,"

KURODA TADAHIRO K. Osada, M. Saen, Y. Okuma, K. Niitsu, Y. Shimazaki, Y. Sugimori, Y. Kohama, K. Kasuga, I. Nonomura, N. Irie, T. Hattori, A. Hasegawa and T. Kuroda,

[International presentation]  IEEE Symposium on VLSI Circuits (Kyoto) , 

2009.06

, 

Oral presentation (general)